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FriendlyELEC NanoPi NEO3 Plus is an ultra-compact headless SBC powered by a Rockchip RK3528A SoC paired with 1GB RAM, whose main interfaces are a Gigabit ...

Introduced at MWC 2026, Quectel FGH200M Wi-Fi HaLow module, based on Morse Micro MM8108 SoC, is an upgraded version of the previous MM6108-based FGH100M ...

The Dabao open-source hardware board features a Boachip-1x RISC-V MCU, whose RTL Verilog files are also open, and is IRIS inspectable.

Back in 2024, Renesas first released the RA0E1, an ultra-low-power Cortex-M23 MCU designed for cost-sensitive applications, followed by the RA0E2, with ...

Qualcomm Snapdragon Wear Elite is described as the "world's first Personal AI wearable platform", and features an NPU for on-device AI delivering up to 12 ...

pureLiFi Bridge XC Flex is a consumer-installable solution designed to be installed on windows (the ones made of glass, not Windows operating system!) in ...

Quectel has just announced two new 5G RedCap modules, the RM255C-GL (Global, M.2) and RG255C-NA (North America, LGA), both of which are 3GPP Release ...

Nordic Semiconductors introduced the nRF93M1 LTE Cat 1bis IoT modules at Mobile World Congress 2026 with up to 10 Mbps downlink and 5 Mbps uplink, as well ...

Qualcomm has unveiled its Wi-Fi 8 (802.11bn) portfolio, which includes the FastConnect 8800 "Mobile Connectivity System", also integrating Bluetooth 7 ...

After checking out the hardware of the GEEKOM A5 Pro 2026 Edition mini PC with an unboxing and a teardown in the first part of the review, I've now had ...